Technical University of Berlin, Research Centre for Microperipheric Technologies<\/strong><\/h3>\n[\/et_pb_text][et_pb_divider color=”#0093a7″ divider_weight=”2px” _builder_version=”4.21.0″ global_colors_info=”{}”][\/et_pb_divider][\/et_pb_column][et_pb_column type=”1_2″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_button button_url=”https:\/\/senior-pro.de\/” button_text=”ZUR\u00dcCK” button_alignment=”right” _builder_version=”4.21.0″ custom_button=”on” button_text_size=”15px” button_text_color=”#ffffff” button_bg_color=”#0093a7″ button_border_color=”#0093a7″ button_border_radius=”0px” button_font=”|600|||||||” button_use_icon=”off” custom_margin=”-2px||||false|false” custom_padding=”14px|37px|14px|37px|true|true” locked=”off” global_colors_info=”{}” button_text_color__hover_enabled=”on|hover” button_text_color__hover=”#ffffff” button_bg_color__hover_enabled=”on|hover” button_bg_color__hover=”#0093a7″ button_bg_enable_color__hover=”on” button_border_color__hover_enabled=”on|hover” button_border_color__hover=”#0093a7″ button_letter_spacing__hover_enabled=”on|hover” button_letter_spacing__hover=”2px”][\/et_pb_button][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”3_5,2_5″ _builder_version=”4.16″ custom_margin=”0px|auto||auto||” custom_padding=”4px||10px|||” locked=”off” global_colors_info=”{}”][et_pb_column type=”3_5″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.22.1″ text_font_size=”16px” hover_enabled=”0″ global_colors_info=”{}” sticky_enabled=”0″]<\/p>\n
The TUB's research focus supports, for example, the reliable packaging of electronic products and the integration of electronics. The core expertise lies in the areas of Substrate Integration Technologies, Wafer Level Integration Technologies, Materials, Reliability and Sustainable Development as well as System Design. The focus here is on increasing reliability, the integration of sensors and actuators as well as miniaturisation and adaptation to given installation spaces with a clear application focus. The subject matter includes the miniaturisation of sensor elements and their integration into textile carriers or thin, stretchable materials. The research centre has a modern production and development infrastructure. New methods and tools are being developed for the technology-orientated design of electronic systems. This is done on the basis of simulations of various electrical, magnetic, electromagnetic, thermal and mechanical coupling phenomena during development.<\/p>\n
Core competencies for the network: robust, miniaturised sensor technology<\/strong><\/span><\/p>\n[\/et_pb_text][\/et_pb_column][et_pb_column type=”2_5″ _builder_version=”4.16″ custom_padding=”30px|30px|30px|30px|true|false” box_shadow_style=”preset1″ global_colors_info=”{}”][et_pb_image src=”https:\/\/senior-pro.de\/media\/2023\/07\/Design-ohne-Titel-2023-07-25T111539.657-1.jpg” title_text=”Design ohne Titel – 2023-07-25T111539.657″ _builder_version=”4.21.0″ custom_margin=”-7px|||||” custom_padding=”|||15px||” global_colors_info=”{}”][\/et_pb_image][et_pb_blurb url=”https:\/\/www.tu.berlin\/tmp\/ueber-uns” use_icon=”on” font_icon=”||divi||400″ icon_color=”#0093a7″ icon_placement=”left” image_icon_width=”25px” _builder_version=”4.22.1″ body_font=”|600|||||||” body_font_size=”19px” body_link_font=”|600|||||||” body_link_text_color=”#0093a7″ body_link_font_size=”18px” body_link_line_height=”1.5em” custom_margin=”||56px|50px|false|false” link_option_url=”https:\/\/www.tu.berlin\/tmp\/ueber-uns” hover_enabled=”0″ icon_font_size=”25px” global_colors_info=”{}” body_link_letter_spacing__hover_enabled=”on|hover” body_link_letter_spacing__hover=”2px” sticky_enabled=”0″]<\/p>\n
Visit website<\/a><\/p>\n[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.16″ global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.16″ global_colors_info=”{}”][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>","protected":false},"excerpt":{"rendered":"
Technische Universit\u00e4t Berlin, Forschungsschwerpunkt Technologien der MikroperipherikDer Forschungsschwerpunkt der TUB unterst\u00fctzt z.B. beim zuverl\u00e4ssigen Packaging elektronischer Produkte und der Integration von Elektronik. Das Kern-Know-how liegt in den Bereichen Substrate Integration Technologies, Wafer Level Integration Technologies, Materials, Reliability and Sustainable Development sowie System Design. Hier stehen die Erh\u00f6hung der Zuverl\u00e4ssigkeit, die Integration von Sensoren und Aktoren […]<\/p>","protected":false},"author":4,"featured_media":23944262,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"dipi_cpt_category":[],"yoast_head":"\n
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